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Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition
Autores principales: | , , , |
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Formato: | Texto |
Lenguaje: | English |
Publicado: |
Springer
2010
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC2893851/ https://www.ncbi.nlm.nih.gov/pubmed/20672121 http://dx.doi.org/10.1007/s11671-010-9539-8 |
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author | Ko, Wen-Yin Chen, Wei-Hung Cheng, Ching-Yuan Lin, Kuan-Jiuh |
author_facet | Ko, Wen-Yin Chen, Wei-Hung Cheng, Ching-Yuan Lin, Kuan-Jiuh |
author_sort | Ko, Wen-Yin |
collection | PubMed |
description | |
format | Text |
id | pubmed-2893851 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2010 |
publisher | Springer |
record_format | MEDLINE/PubMed |
spelling | pubmed-28938512010-07-28 Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition Ko, Wen-Yin Chen, Wei-Hung Cheng, Ching-Yuan Lin, Kuan-Jiuh Nanoscale Res Lett Correction Springer 2010-01-29 /pmc/articles/PMC2893851/ /pubmed/20672121 http://dx.doi.org/10.1007/s11671-010-9539-8 Text en Copyright ©2010 The Author(s) |
spellingShingle | Correction Ko, Wen-Yin Chen, Wei-Hung Cheng, Ching-Yuan Lin, Kuan-Jiuh Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition |
title | Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition |
title_full | Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition |
title_fullStr | Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition |
title_full_unstemmed | Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition |
title_short | Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition |
title_sort | erratum to: architectural growth of cu nanoparticles through electrodeposition |
topic | Correction |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC2893851/ https://www.ncbi.nlm.nih.gov/pubmed/20672121 http://dx.doi.org/10.1007/s11671-010-9539-8 |
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