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Architectural Growth of Cu Nanoparticles Through Electrodeposition
Cu particles with different architectures such as pyramid, cube, and multipod have been successfully fabricated on the surface of Au films, which is the polycrystalline Au substrate with (111) domains, using the electrodeposition technique in the presence of the surface-capping reagents of dodecylbe...
| Autores principales: | , , , |
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| Formato: | Texto |
| Lenguaje: | English |
| Publicado: |
Springer
2009
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC2893912/ https://www.ncbi.nlm.nih.gov/pubmed/20652131 http://dx.doi.org/10.1007/s11671-009-9424-5 |