Characterization of the mechanical and thermal interface of copper films on carbon substrates modified by boron based interlayers

The manipulation of mechanical and thermal interfaces is essential for the design of modern composites. Amongst these are copper carbon composites which can exhibit excellent heat conductivities if the Cu/C interface is affected by a suitable interlayer to minimize the Thermal Contact Resistance (TC...

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Detalles Bibliográficos
Autores principales: Schäfer, D., Eisenmenger-Sittner, C., Chirtoc, Mihai, Kijamnajsuk, P., Kornfeind, N., Hutter, H., Neubauer, E., Kitzmantel, M.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Elsevier Sequoia 2011
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3252241/
https://www.ncbi.nlm.nih.gov/pubmed/22241938
http://dx.doi.org/10.1016/j.surfcoat.2011.01.039

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3252241/
https://www.ncbi.nlm.nih.gov/pubmed/22241938
http://dx.doi.org/10.1016/j.surfcoat.2011.01.039

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