Cargando…
Characterization of the mechanical and thermal interface of copper films on carbon substrates modified by boron based interlayers
The manipulation of mechanical and thermal interfaces is essential for the design of modern composites. Amongst these are copper carbon composites which can exhibit excellent heat conductivities if the Cu/C interface is affected by a suitable interlayer to minimize the Thermal Contact Resistance (TC...
| Autores principales: | , , , , , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Elsevier Sequoia
2011
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3252241/ https://www.ncbi.nlm.nih.gov/pubmed/22241938 http://dx.doi.org/10.1016/j.surfcoat.2011.01.039 |