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High-Performance Piezoresistive MEMS Strain Sensor with Low Thermal Sensitivity

This paper presents the experimental evaluation of a new piezoresistive MEMS strain sensor. Geometric characteristics of the sensor silicon carrier have been employed to improve the sensor sensitivity. Surface features or trenches have been introduced in the vicinity of the sensing elements. These f...

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Detalles Bibliográficos
Autores principales: Mohammed, Ahmed A. S., Moussa, Walied A., Lou, Edmond
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Molecular Diversity Preservation International (MDPI) 2011
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3274016/
https://www.ncbi.nlm.nih.gov/pubmed/22319384
http://dx.doi.org/10.3390/s110201819