Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach

Failure of packaged polysilicon micro-electro-mechanical systems (MEMS) subjected to impacts involves phenomena occurring at several length-scales. In this paper we present a multi-scale finite element approach to properly allow for: (i) the propagation of stress waves inside the package; (ii) the d...

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Detalles Bibliográficos
Autores principales: Mariani, Stefano, Ghisi, Aldo, Corigliano, Alberto, Zerbini, Sarah
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Molecular Diversity Preservation International (MDPI) 2009
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3280763/
https://www.ncbi.nlm.nih.gov/pubmed/22389617
http://dx.doi.org/10.3390/s90100556

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3280763/
https://www.ncbi.nlm.nih.gov/pubmed/22389617
http://dx.doi.org/10.3390/s90100556

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