Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach

Failure of packaged polysilicon micro-electro-mechanical systems (MEMS) subjected to impacts involves phenomena occurring at several length-scales. In this paper we present a multi-scale finite element approach to properly allow for: (i) the propagation of stress waves inside the package; (ii) the d...

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Autores principales: Mariani, Stefano, Ghisi, Aldo, Corigliano, Alberto, Zerbini, Sarah
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Molecular Diversity Preservation International (MDPI) 2009
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3280763/
https://www.ncbi.nlm.nih.gov/pubmed/22389617
http://dx.doi.org/10.3390/s90100556
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author Mariani, Stefano
Ghisi, Aldo
Corigliano, Alberto
Zerbini, Sarah
author_facet Mariani, Stefano
Ghisi, Aldo
Corigliano, Alberto
Zerbini, Sarah
author_sort Mariani, Stefano
collection PubMed
description Failure of packaged polysilicon micro-electro-mechanical systems (MEMS) subjected to impacts involves phenomena occurring at several length-scales. In this paper we present a multi-scale finite element approach to properly allow for: (i) the propagation of stress waves inside the package; (ii) the dynamics of the whole MEMS; (iii) the spreading of micro-cracking in the failing part(s) of the sensor. Through Monte Carlo simulations, some effects of polysilicon micro-structure on the failure mode are elucidated.
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spelling pubmed-32807632012-03-02 Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach Mariani, Stefano Ghisi, Aldo Corigliano, Alberto Zerbini, Sarah Sensors (Basel) Article Failure of packaged polysilicon micro-electro-mechanical systems (MEMS) subjected to impacts involves phenomena occurring at several length-scales. In this paper we present a multi-scale finite element approach to properly allow for: (i) the propagation of stress waves inside the package; (ii) the dynamics of the whole MEMS; (iii) the spreading of micro-cracking in the failing part(s) of the sensor. Through Monte Carlo simulations, some effects of polysilicon micro-structure on the failure mode are elucidated. Molecular Diversity Preservation International (MDPI) 2009-01-19 /pmc/articles/PMC3280763/ /pubmed/22389617 http://dx.doi.org/10.3390/s90100556 Text en © 2009 by the authors; licensee Molecular Diversity Preservation International, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution license (http://creativecommons.org/licenses/by/3.0/).
spellingShingle Article
Mariani, Stefano
Ghisi, Aldo
Corigliano, Alberto
Zerbini, Sarah
Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach
title Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach
title_full Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach
title_fullStr Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach
title_full_unstemmed Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach
title_short Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach
title_sort modeling impact-induced failure of polysilicon mems: a multi-scale approach
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3280763/
https://www.ncbi.nlm.nih.gov/pubmed/22389617
http://dx.doi.org/10.3390/s90100556
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AT zerbinisarah modelingimpactinducedfailureofpolysiliconmemsamultiscaleapproach

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