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Development of a Three Dimensional Neural Sensing Device by a Stacking Method

This study reports a new stacking method for assembling a 3-D microprobe array. To date, 3-D array structures have usually been assembled with vertical spacers, snap fasteners and a supporting platform. Such methods have achieved 3-D structures but suffer from complex assembly steps, vertical interc...

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Detalles Bibliográficos
Autores principales: Chang, Chih-Wei, Chiou, Jin-Chern
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Molecular Diversity Preservation International (MDPI) 2010
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3292117/
https://www.ncbi.nlm.nih.gov/pubmed/22399878
http://dx.doi.org/10.3390/s100504238