Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick Photoresists

A novel plastic packaging of a piezoresistive pressure sensor using a patterned ultra-thick photoresist is experimentally and theoretically investigated. Two pressure sensor packages of the sacrifice-replacement and dam-ring type were used in this study. The characteristics of the packaged pressure...

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Detalles Bibliográficos
Autores principales: Chen, Lung-Tai, Chang, Jin-Sheng, Hsu, Chung-Yi, Cheng, Wood-Hi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Molecular Diversity Preservation International (MDPI) 2009
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3312439/
https://www.ncbi.nlm.nih.gov/pubmed/22454580
http://dx.doi.org/10.3390/s90806200

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3312439/
https://www.ncbi.nlm.nih.gov/pubmed/22454580
http://dx.doi.org/10.3390/s90806200

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