Crosstalk analysis of carbon nanotube bundle interconnects

Carbon nanotube (CNT) has been considered as an ideal interconnect material for replacing copper for future nanoscale IC technology due to its outstanding current carrying capability, thermal conductivity, and mechanical robustness. In this paper, crosstalk problems for single-walled carbon nanotube...

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Detalles Bibliográficos
Autores principales: Zhang, Kailiang, Tian, Bo, Zhu, Xiaosong, Wang, Fang, Wei, Jun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer 2012
Materias:
Nano Express
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3312833/
https://www.ncbi.nlm.nih.gov/pubmed/22340628
http://dx.doi.org/10.1186/1556-276X-7-138

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3312833/
https://www.ncbi.nlm.nih.gov/pubmed/22340628
http://dx.doi.org/10.1186/1556-276X-7-138

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