Cargando…
Crosstalk analysis of carbon nanotube bundle interconnects
Carbon nanotube (CNT) has been considered as an ideal interconnect material for replacing copper for future nanoscale IC technology due to its outstanding current carrying capability, thermal conductivity, and mechanical robustness. In this paper, crosstalk problems for single-walled carbon nanotube...
| Autores principales: | , , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Springer
2012
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3312833/ https://www.ncbi.nlm.nih.gov/pubmed/22340628 http://dx.doi.org/10.1186/1556-276X-7-138 |