Carbon nanotube bumps for the flip chip packaging system

Carbon nanotube [CNT] interconnection bump joining methodology has been successfully demonstrated using flip chip test structures with bump pitches smaller than 150 μm. In this study, plasma-enhanced chemical vapor deposition approach is used to grow the CNT bumps onto the Au metallization lines. Th...

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Detalles Bibliográficos
Autores principales: Yap, Chin Chong, Brun, Christophe, Tan, Dunlin, Li, Hong, Teo, Edwin Hang Tong, Baillargeat, Dominique, Tay, Beng Kang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer 2012
Materias:
Nano Express
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3338392/
https://www.ncbi.nlm.nih.gov/pubmed/22313721
http://dx.doi.org/10.1186/1556-276X-7-105

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3338392/
https://www.ncbi.nlm.nih.gov/pubmed/22313721
http://dx.doi.org/10.1186/1556-276X-7-105

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