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Applications of multi-walled carbon nanotube in electronic packaging
Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them,...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Springer
2012
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3342093/ https://www.ncbi.nlm.nih.gov/pubmed/22405035 http://dx.doi.org/10.1186/1556-276X-7-183 |