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Applications of multi-walled carbon nanotube in electronic packaging

Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them,...

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Detalles Bibliográficos
Autores principales: Tan, Cher Ming, Baudot, Charles, Han, Yongdian, Jing, Hongyang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer 2012
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3342093/
https://www.ncbi.nlm.nih.gov/pubmed/22405035
http://dx.doi.org/10.1186/1556-276X-7-183
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author Tan, Cher Ming
Baudot, Charles
Han, Yongdian
Jing, Hongyang
author_facet Tan, Cher Ming
Baudot, Charles
Han, Yongdian
Jing, Hongyang
author_sort Tan, Cher Ming
collection PubMed
description Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them, and thus they must also be mechanically strong so as to provide a good mechanical support to the chip. The use of multi-walled carbon nanotube to enhance the thermal conductivity, and the mechanical strength of die attach epoxy and Pb-free solder is demonstrated in this work.
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spelling pubmed-33420932012-05-03 Applications of multi-walled carbon nanotube in electronic packaging Tan, Cher Ming Baudot, Charles Han, Yongdian Jing, Hongyang Nanoscale Res Lett Nano Express Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them, and thus they must also be mechanically strong so as to provide a good mechanical support to the chip. The use of multi-walled carbon nanotube to enhance the thermal conductivity, and the mechanical strength of die attach epoxy and Pb-free solder is demonstrated in this work. Springer 2012-03-09 /pmc/articles/PMC3342093/ /pubmed/22405035 http://dx.doi.org/10.1186/1556-276X-7-183 Text en Copyright ©2012 Tan et al; licensee Springer. http://creativecommons.org/licenses/by/2.0 This is an Open Access article distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/2.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
spellingShingle Nano Express
Tan, Cher Ming
Baudot, Charles
Han, Yongdian
Jing, Hongyang
Applications of multi-walled carbon nanotube in electronic packaging
title Applications of multi-walled carbon nanotube in electronic packaging
title_full Applications of multi-walled carbon nanotube in electronic packaging
title_fullStr Applications of multi-walled carbon nanotube in electronic packaging
title_full_unstemmed Applications of multi-walled carbon nanotube in electronic packaging
title_short Applications of multi-walled carbon nanotube in electronic packaging
title_sort applications of multi-walled carbon nanotube in electronic packaging
topic Nano Express
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3342093/
https://www.ncbi.nlm.nih.gov/pubmed/22405035
http://dx.doi.org/10.1186/1556-276X-7-183
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