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Applications of multi-walled carbon nanotube in electronic packaging
Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them,...
Autores principales: | , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Springer
2012
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3342093/ https://www.ncbi.nlm.nih.gov/pubmed/22405035 http://dx.doi.org/10.1186/1556-276X-7-183 |
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author | Tan, Cher Ming Baudot, Charles Han, Yongdian Jing, Hongyang |
author_facet | Tan, Cher Ming Baudot, Charles Han, Yongdian Jing, Hongyang |
author_sort | Tan, Cher Ming |
collection | PubMed |
description | Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them, and thus they must also be mechanically strong so as to provide a good mechanical support to the chip. The use of multi-walled carbon nanotube to enhance the thermal conductivity, and the mechanical strength of die attach epoxy and Pb-free solder is demonstrated in this work. |
format | Online Article Text |
id | pubmed-3342093 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2012 |
publisher | Springer |
record_format | MEDLINE/PubMed |
spelling | pubmed-33420932012-05-03 Applications of multi-walled carbon nanotube in electronic packaging Tan, Cher Ming Baudot, Charles Han, Yongdian Jing, Hongyang Nanoscale Res Lett Nano Express Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them, and thus they must also be mechanically strong so as to provide a good mechanical support to the chip. The use of multi-walled carbon nanotube to enhance the thermal conductivity, and the mechanical strength of die attach epoxy and Pb-free solder is demonstrated in this work. Springer 2012-03-09 /pmc/articles/PMC3342093/ /pubmed/22405035 http://dx.doi.org/10.1186/1556-276X-7-183 Text en Copyright ©2012 Tan et al; licensee Springer. http://creativecommons.org/licenses/by/2.0 This is an Open Access article distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/2.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. |
spellingShingle | Nano Express Tan, Cher Ming Baudot, Charles Han, Yongdian Jing, Hongyang Applications of multi-walled carbon nanotube in electronic packaging |
title | Applications of multi-walled carbon nanotube in electronic packaging |
title_full | Applications of multi-walled carbon nanotube in electronic packaging |
title_fullStr | Applications of multi-walled carbon nanotube in electronic packaging |
title_full_unstemmed | Applications of multi-walled carbon nanotube in electronic packaging |
title_short | Applications of multi-walled carbon nanotube in electronic packaging |
title_sort | applications of multi-walled carbon nanotube in electronic packaging |
topic | Nano Express |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3342093/ https://www.ncbi.nlm.nih.gov/pubmed/22405035 http://dx.doi.org/10.1186/1556-276X-7-183 |
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