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A High Sensitivity Three-Dimensional-Shape Sensing Patch Prepared by Lithography and Inkjet Printing
A process combining conventional photolithography and a novel inkjet printing method for the manufacture of high sensitivity three-dimensional-shape (3DS) sensing patches was proposed and demonstrated. The supporting curvature ranges from 1.41 to 6.24 × 10(−2) mm(−1) and the sensing patch has a thic...
Autores principales: | Huang, Yi-Ren, Kuo, Sheng-An, Stach, Michal, Liu, Chia-Hsing, Liao, Kuan-Hsun, Lo, Cheng-Yao |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Molecular Diversity Preservation International (MDPI)
2012
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3355406/ https://www.ncbi.nlm.nih.gov/pubmed/22666025 http://dx.doi.org/10.3390/s120404172 |
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