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Copper-selective electrochemical filling of macropore arrays for through-silicon via applications
In this article, the physico-chemical and electrochemical conditions of through-silicon via formation were studied. First, macropore arrays were etched through a low doped n-type silicon wafer by anodization under illumination into a hydrofluoric acid-based electrolyte. After electrochemical etching...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Springer
2012
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3414756/ https://www.ncbi.nlm.nih.gov/pubmed/22776559 http://dx.doi.org/10.1186/1556-276X-7-375 |