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A flexible nanobrush pad for the chemical mechanical planarization of Cu/ultra-low-к materials
A new idea of polishing pad called flexible nanobrush pad (FNP) has been proposed for the low down pressure chemical mechanical planarization (CMP) process of Cu/ultra-low-к materials. The FNP was designed with a surface layer of flexible brush-like nanofibers which can ‘actively’ carry nanoscale ab...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Springer
2012
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3499454/ https://www.ncbi.nlm.nih.gov/pubmed/23110959 http://dx.doi.org/10.1186/1556-276X-7-603 |