An elevated temperature study of a Ti adhesion layer on polyimide

Titanium layers are used to promote adhesion between polymer substrates for flexible electronics and the Cu or Au conducting lines. Good adhesion of conducting lines in flexible circuits is critical in improving circuit performance and increasingcircuit lifetime. Nominally 50 nm thick Ti films on po...

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Detalles Bibliográficos
Autores principales: Taylor, A.A., Cordill, M.J., Bowles, L., Schalko, J., Dehm, G.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Elsevier 2013
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3605824/
https://www.ncbi.nlm.nih.gov/pubmed/23525510
http://dx.doi.org/10.1016/j.tsf.2013.01.016

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3605824/
https://www.ncbi.nlm.nih.gov/pubmed/23525510
http://dx.doi.org/10.1016/j.tsf.2013.01.016

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