Influence of embedding Cu nano-particles into a Cu/SiO(2)/Pt structure on its resistive switching

Cu nano-particles (Cu-NPs) were embedded into the SiO(2) layer of a Cu/SiO(2)/Pt structure to examine their influence on resistive switching characteristics. The device showed a reversible resistive switching behavior, which was due to the formation and rupture of a Cu-conducting filament with an electrochemical reaction. The Cu-NPs enhanced the local electric field within the SiO(2) layer, which caused a decrease in the forming voltage. During successive switching processes, the Cu-NP was partially dissolved, which changed its shape. Therefore, the switching voltages were not reduced. Moreover, the Cu-NPs caused a non-uniform Cu concentration within the SiO(2) layer; thus, the Cu-conducting filament should be formed in a high Cu concentration region, which improves switching dispersion. The Cu-NPs within the SiO(2) layer stabilize the resistive switching, resulting in a larger switching window and better endurance characteristics.