Sputtered Encapsulation as Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated on a Capacitive Accelerometer

This paper discusses sputtered silicon encapsulation as a wafer level packaging approach for isolatable MEMS devices. Devices such as accelerometers, RF switches, inductors, and filters that do not require interaction with the surroundings to function, could thus be fully encapsulated at the wafer l...

Descripción completa

Detalles Bibliográficos
Autores principales: Hamzah, Azrul Azlan, Yunas, Jumril, Majlis, Burhanuddin Yeop, Ahmad, Ibrahim
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Molecular Diversity Preservation International (MDPI) 2008
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3787454/
https://www.ncbi.nlm.nih.gov/pubmed/27873938
http://dx.doi.org/10.3390/s8117438

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3787454/
https://www.ncbi.nlm.nih.gov/pubmed/27873938
http://dx.doi.org/10.3390/s8117438

Ejemplares similares