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Peel-and-Stick: Mechanism Study for Efficient Fabrication of Flexible/Transparent Thin-film Electronics

Peel-and-stick process, or water-assisted transfer printing (WTP), represents an emerging process for transferring fully fabricated thin-film electronic devices with high yield and fidelity from a SiO(2)/Si wafer to various non-Si based substrates, including papers, plastics and polymers. This study...

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Detalles Bibliográficos
Autores principales: Lee, Chi Hwan, Kim, Jae-Han, Zou, Chenyu, Cho, In Sun, Weisse, Jeffery M., Nemeth, William, Wang, Qi, van Duin, Adri C. T., Kim, Taek-Soo, Zheng, Xiaolin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2013
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3794378/
https://www.ncbi.nlm.nih.gov/pubmed/24108063
http://dx.doi.org/10.1038/srep02917