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Enhanced resistive switching phenomena using low-positive-voltage format and self-compliance IrO(x)/GdO(x)/W cross-point memories

Enhanced resistive switching phenomena of IrO(x)/GdO(x)/W cross-point memory devices have been observed as compared to the via-hole devices. The as-deposited Gd(2)O(3) films with a thickness of approximately 15 nm show polycrystalline that is observed using high-resolution transmission electron micr...

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Detalles Bibliográficos
Autores principales: Jana, Debanjan, Maikap, Siddheswar, Prakash, Amit, Chen, Yi-Yan, Chiu, Hsien-Chin, Yang, Jer-Ren
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer 2014
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3896962/
https://www.ncbi.nlm.nih.gov/pubmed/24400888
http://dx.doi.org/10.1186/1556-276X-9-12
Descripción
Sumario:Enhanced resistive switching phenomena of IrO(x)/GdO(x)/W cross-point memory devices have been observed as compared to the via-hole devices. The as-deposited Gd(2)O(3) films with a thickness of approximately 15 nm show polycrystalline that is observed using high-resolution transmission electron microscope. Via-hole memory device shows bipolar resistive switching phenomena with a large formation voltage of -6.4 V and high operation current of >1 mA, while the cross-point memory device shows also bipolar resistive switching with low-voltage format of +2 V and self-compliance operation current of <300 μA. Switching mechanism is based on the formation and rupture of conducting filament at the IrO(x)/GdO(x) interface, owing to oxygen ion migration. The oxygen-rich GdO(x) layer formation at the IrO(x)/GdO(x) interface will also help control the resistive switching characteristics. This cross-point memory device has also Repeatable 100 DC switching cycles, narrow distribution of LRS/HRS, excellent pulse endurance of >10,000 in every cycle, and good data retention of >10(4) s. This memory device has great potential for future nanoscale high-density non-volatile memory applications.