The use of polyimide-modified aluminum nitride fillers in AlN@PI/Epoxy composites with enhanced thermal conductivity for electronic encapsulation

Polymer modified fillers in composites has attracted the attention of numerous researchers. These fillers are composed of core-shell structures that exhibit enhanced physical and chemical properties that are associated with shell surface control and encapsulated core materials. In this study, we hav...

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Detalles Bibliográficos
Autores principales: Zhou, Yongcun, Yao, Yagang, Chen, Chia-Yun, Moon, Kyoungsik, Wang, Hong, Wong, Ching-ping
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2014
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3998031/
https://www.ncbi.nlm.nih.gov/pubmed/24759082
http://dx.doi.org/10.1038/srep04779

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3998031/
https://www.ncbi.nlm.nih.gov/pubmed/24759082
http://dx.doi.org/10.1038/srep04779

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