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Platinum metallization for MEMS application: Focus on coating adhesion for biomedical applications
The adherence of Platinum thin film on Si/SiO(2) wafer was studies using Chromium, Titanium or Alumina (Cr, Ti, Al(2)O(3)) as interlayer. The adhesion of Pt is a fundamental property in different areas, for example in MEMS devices, which operate at high temperature conditions, as well as in biomedic...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Landes Bioscience
2014
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4122564/ https://www.ncbi.nlm.nih.gov/pubmed/24743057 http://dx.doi.org/10.4161/biom.28822 |