Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding

This paper presents one wafer level packaging approach of quartz resonator based on through-silicon via (TSV) interposer with metal or polymer bonding sealing of frequency components. The proposed silicon-based package of quartz resonator adopts several three-dimensional (3D) core technologies, such...

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Detalles Bibliográficos
Autores principales: Shih, Jian-Yu, Chen, Yen-Chi, Chiu, Chih-Hung, Lo, Chung-Lun, Chang, Chi-Chung, Chen, Kuan-Neng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer 2014
Materias:
Nano Express
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4197941/
https://www.ncbi.nlm.nih.gov/pubmed/25324705
http://dx.doi.org/10.1186/1556-276X-9-541

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4197941/
https://www.ncbi.nlm.nih.gov/pubmed/25324705
http://dx.doi.org/10.1186/1556-276X-9-541

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