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Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding

This paper presents one wafer level packaging approach of quartz resonator based on through-silicon via (TSV) interposer with metal or polymer bonding sealing of frequency components. The proposed silicon-based package of quartz resonator adopts several three-dimensional (3D) core technologies, such...

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Detalles Bibliográficos
Autores principales:	Shih, Jian-Yu, Chen, Yen-Chi, Chiu, Chih-Hung, Lo, Chung-Lun, Chang, Chi-Chung, Chen, Kuan-Neng
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	Springer 2014
Materias:	Nano Express
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4197941/ https://www.ncbi.nlm.nih.gov/pubmed/25324705 http://dx.doi.org/10.1186/1556-276X-9-541

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