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Evaluation of mobility in thin Bi(2)Se(3) Topological Insulator for prospects of Local Electrical Interconnects

Three-dimensional (3D) topological insulator (TI) has been conjectured as an emerging material to replace copper (Cu) as an interconnect material because of the suppression of elastic scattering from doping and charge impurities for carrier transport on TI surface. We, therefore via full real-space...

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Autores principales: Gupta, Gaurav, Jalil, Mansoor Bin Abdul, Liang, Gengchiau
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2014
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4213797/
https://www.ncbi.nlm.nih.gov/pubmed/25354476
http://dx.doi.org/10.1038/srep06838
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author Gupta, Gaurav
Jalil, Mansoor Bin Abdul
Liang, Gengchiau
author_facet Gupta, Gaurav
Jalil, Mansoor Bin Abdul
Liang, Gengchiau
author_sort Gupta, Gaurav
collection PubMed
description Three-dimensional (3D) topological insulator (TI) has been conjectured as an emerging material to replace copper (Cu) as an interconnect material because of the suppression of elastic scattering from doping and charge impurities for carrier transport on TI surface. We, therefore via full real-space simulation, examine the feasibility of using thin 3D-TI (Bi(2)Se(3)) wire for the local electrical interconnects in the presence of edge roughness, vacancies, acoustic phonons and charge impurities across temperature and Fermi-level by simulating quantum transport through Non-Equilibrium Green Function algorithm. We found that because of the scattering induced by the acoustic phonons, the mobility reduces considerably at the room temperature which complemented with the low density of states near Dirac-point does not position Bi(2)Se(3) 3D-TI as a promising material to replace Cu for local interconnects. Properties required in suitable TI material for this application have also been discussed.
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spelling pubmed-42137972014-10-31 Evaluation of mobility in thin Bi(2)Se(3) Topological Insulator for prospects of Local Electrical Interconnects Gupta, Gaurav Jalil, Mansoor Bin Abdul Liang, Gengchiau Sci Rep Article Three-dimensional (3D) topological insulator (TI) has been conjectured as an emerging material to replace copper (Cu) as an interconnect material because of the suppression of elastic scattering from doping and charge impurities for carrier transport on TI surface. We, therefore via full real-space simulation, examine the feasibility of using thin 3D-TI (Bi(2)Se(3)) wire for the local electrical interconnects in the presence of edge roughness, vacancies, acoustic phonons and charge impurities across temperature and Fermi-level by simulating quantum transport through Non-Equilibrium Green Function algorithm. We found that because of the scattering induced by the acoustic phonons, the mobility reduces considerably at the room temperature which complemented with the low density of states near Dirac-point does not position Bi(2)Se(3) 3D-TI as a promising material to replace Cu for local interconnects. Properties required in suitable TI material for this application have also been discussed. Nature Publishing Group 2014-10-30 /pmc/articles/PMC4213797/ /pubmed/25354476 http://dx.doi.org/10.1038/srep06838 Text en Copyright © 2014, Macmillan Publishers Limited. All rights reserved http://creativecommons.org/licenses/by-nc-sa/4.0/ This work is licensed under a Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International License. The images or other third party material in this article are included in the article's Creative Commons license, unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license, users will need to obtain permission from the license holder in order to reproduce the material. To view a copy of this license, visit http://creativecommons.org/licenses/by-nc-sa/4.0/
spellingShingle Article
Gupta, Gaurav
Jalil, Mansoor Bin Abdul
Liang, Gengchiau
Evaluation of mobility in thin Bi(2)Se(3) Topological Insulator for prospects of Local Electrical Interconnects
title Evaluation of mobility in thin Bi(2)Se(3) Topological Insulator for prospects of Local Electrical Interconnects
title_full Evaluation of mobility in thin Bi(2)Se(3) Topological Insulator for prospects of Local Electrical Interconnects
title_fullStr Evaluation of mobility in thin Bi(2)Se(3) Topological Insulator for prospects of Local Electrical Interconnects
title_full_unstemmed Evaluation of mobility in thin Bi(2)Se(3) Topological Insulator for prospects of Local Electrical Interconnects
title_short Evaluation of mobility in thin Bi(2)Se(3) Topological Insulator for prospects of Local Electrical Interconnects
title_sort evaluation of mobility in thin bi(2)se(3) topological insulator for prospects of local electrical interconnects
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4213797/
https://www.ncbi.nlm.nih.gov/pubmed/25354476
http://dx.doi.org/10.1038/srep06838
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