Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate

The downsizing of solder balls results in larger interfacial intermetallic compound (IMC) grains and less Cu substrate consumption in lead-free soldering on Cu substrates. This size effect on the interfacial reaction is experimentally demonstrated and theoretically analyzed using Sn-3.0Ag-0.5Cu and...

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Detalles Bibliográficos
Autores principales: Huang, M. L., Yang, F.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2014
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4236743/
https://www.ncbi.nlm.nih.gov/pubmed/25408359
http://dx.doi.org/10.1038/srep07117

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4236743/
https://www.ncbi.nlm.nih.gov/pubmed/25408359
http://dx.doi.org/10.1038/srep07117

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