Cargando…
Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate
The downsizing of solder balls results in larger interfacial intermetallic compound (IMC) grains and less Cu substrate consumption in lead-free soldering on Cu substrates. This size effect on the interfacial reaction is experimentally demonstrated and theoretically analyzed using Sn-3.0Ag-0.5Cu and...
| Autores principales: | , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group
2014
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4236743/ https://www.ncbi.nlm.nih.gov/pubmed/25408359 http://dx.doi.org/10.1038/srep07117 |