Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers

A solvent-free method for the fabrication of thermally conductive epoxy-boron nitride (BN) nanoplatelet composite material is developed in this study. By this method, polymer composites with nearly any filler fractions can be easily fabricated. The maximum thermal conductivity reaches 5.24 W/mK, whi...

Descripción completa

Detalles Bibliográficos
Autores principales: Wang, Zifeng, Fu, Yuqiao, Meng, Wenjun, Zhi, Chunyi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer 2014
Materias:
Nano Express
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4257055/
https://www.ncbi.nlm.nih.gov/pubmed/25489292
http://dx.doi.org/10.1186/1556-276X-9-643

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4257055/
https://www.ncbi.nlm.nih.gov/pubmed/25489292
http://dx.doi.org/10.1186/1556-276X-9-643

Ejemplares similares