Cargando…
Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers
A solvent-free method for the fabrication of thermally conductive epoxy-boron nitride (BN) nanoplatelet composite material is developed in this study. By this method, polymer composites with nearly any filler fractions can be easily fabricated. The maximum thermal conductivity reaches 5.24 W/mK, whi...
Autores principales: | , , , |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Springer
2014
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4257055/ https://www.ncbi.nlm.nih.gov/pubmed/25489292 http://dx.doi.org/10.1186/1556-276X-9-643 |
_version_ | 1782347675806466048 |
---|---|
author | Wang, Zifeng Fu, Yuqiao Meng, Wenjun Zhi, Chunyi |
author_facet | Wang, Zifeng Fu, Yuqiao Meng, Wenjun Zhi, Chunyi |
author_sort | Wang, Zifeng |
collection | PubMed |
description | A solvent-free method for the fabrication of thermally conductive epoxy-boron nitride (BN) nanoplatelet composite material is developed in this study. By this method, polymer composites with nearly any filler fractions can be easily fabricated. The maximum thermal conductivity reaches 5.24 W/mK, which is 1,600% improvement in comparison with that of pristine epoxy material. In addition, the as-fabricated samples exhibit excellent overall performances with great mechanical property and thermal stability well preserved. |
format | Online Article Text |
id | pubmed-4257055 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2014 |
publisher | Springer |
record_format | MEDLINE/PubMed |
spelling | pubmed-42570552014-12-08 Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers Wang, Zifeng Fu, Yuqiao Meng, Wenjun Zhi, Chunyi Nanoscale Res Lett Nano Express A solvent-free method for the fabrication of thermally conductive epoxy-boron nitride (BN) nanoplatelet composite material is developed in this study. By this method, polymer composites with nearly any filler fractions can be easily fabricated. The maximum thermal conductivity reaches 5.24 W/mK, which is 1,600% improvement in comparison with that of pristine epoxy material. In addition, the as-fabricated samples exhibit excellent overall performances with great mechanical property and thermal stability well preserved. Springer 2014-11-29 /pmc/articles/PMC4257055/ /pubmed/25489292 http://dx.doi.org/10.1186/1556-276X-9-643 Text en Copyright © 2014 Wang et al.; licensee Springer. http://creativecommons.org/licenses/by/4.0 This is an Open Access article distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly credited. |
spellingShingle | Nano Express Wang, Zifeng Fu, Yuqiao Meng, Wenjun Zhi, Chunyi Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers |
title | Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers |
title_full | Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers |
title_fullStr | Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers |
title_full_unstemmed | Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers |
title_short | Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers |
title_sort | solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers |
topic | Nano Express |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4257055/ https://www.ncbi.nlm.nih.gov/pubmed/25489292 http://dx.doi.org/10.1186/1556-276X-9-643 |
work_keys_str_mv | AT wangzifeng solventfreefabricationofthermallyconductiveinsulatingepoxycompositeswithboronnitridenanoplateletsasfillers AT fuyuqiao solventfreefabricationofthermallyconductiveinsulatingepoxycompositeswithboronnitridenanoplateletsasfillers AT mengwenjun solventfreefabricationofthermallyconductiveinsulatingepoxycompositeswithboronnitridenanoplateletsasfillers AT zhichunyi solventfreefabricationofthermallyconductiveinsulatingepoxycompositeswithboronnitridenanoplateletsasfillers |