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Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers

A solvent-free method for the fabrication of thermally conductive epoxy-boron nitride (BN) nanoplatelet composite material is developed in this study. By this method, polymer composites with nearly any filler fractions can be easily fabricated. The maximum thermal conductivity reaches 5.24 W/mK, whi...

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Detalles Bibliográficos
Autores principales: Wang, Zifeng, Fu, Yuqiao, Meng, Wenjun, Zhi, Chunyi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer 2014
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4257055/
https://www.ncbi.nlm.nih.gov/pubmed/25489292
http://dx.doi.org/10.1186/1556-276X-9-643
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author Wang, Zifeng
Fu, Yuqiao
Meng, Wenjun
Zhi, Chunyi
author_facet Wang, Zifeng
Fu, Yuqiao
Meng, Wenjun
Zhi, Chunyi
author_sort Wang, Zifeng
collection PubMed
description A solvent-free method for the fabrication of thermally conductive epoxy-boron nitride (BN) nanoplatelet composite material is developed in this study. By this method, polymer composites with nearly any filler fractions can be easily fabricated. The maximum thermal conductivity reaches 5.24 W/mK, which is 1,600% improvement in comparison with that of pristine epoxy material. In addition, the as-fabricated samples exhibit excellent overall performances with great mechanical property and thermal stability well preserved.
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spelling pubmed-42570552014-12-08 Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers Wang, Zifeng Fu, Yuqiao Meng, Wenjun Zhi, Chunyi Nanoscale Res Lett Nano Express A solvent-free method for the fabrication of thermally conductive epoxy-boron nitride (BN) nanoplatelet composite material is developed in this study. By this method, polymer composites with nearly any filler fractions can be easily fabricated. The maximum thermal conductivity reaches 5.24 W/mK, which is 1,600% improvement in comparison with that of pristine epoxy material. In addition, the as-fabricated samples exhibit excellent overall performances with great mechanical property and thermal stability well preserved. Springer 2014-11-29 /pmc/articles/PMC4257055/ /pubmed/25489292 http://dx.doi.org/10.1186/1556-276X-9-643 Text en Copyright © 2014 Wang et al.; licensee Springer. http://creativecommons.org/licenses/by/4.0 This is an Open Access article distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly credited.
spellingShingle Nano Express
Wang, Zifeng
Fu, Yuqiao
Meng, Wenjun
Zhi, Chunyi
Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers
title Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers
title_full Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers
title_fullStr Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers
title_full_unstemmed Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers
title_short Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers
title_sort solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers
topic Nano Express
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4257055/
https://www.ncbi.nlm.nih.gov/pubmed/25489292
http://dx.doi.org/10.1186/1556-276X-9-643
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