A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology

For the dimensional measurement and characterization of microsized and nanosized components, a three-dimensional microdisplacement sensing system was developed using the piezoresistive effect in silicon. The sensor was fabricated using microelectromechanical system bulk-silicon technology, and it wa...

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Detalles Bibliográficos
Autores principales: Wu, Junjie, Lei, Lihua, Chen, Xin, Cai, Xiaoyu, Li, Yuan, Han, Tao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2014
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4279498/
https://www.ncbi.nlm.nih.gov/pubmed/25360581
http://dx.doi.org/10.3390/s141120533

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4279498/
https://www.ncbi.nlm.nih.gov/pubmed/25360581
http://dx.doi.org/10.3390/s141120533

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