A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging

This paper presents a high-Q resonant pressure microsensor with through-glass electrical interconnections based on wafer-level MEMS vacuum packaging. An approach to maintaining high-vacuum conditions by integrating the MEMS fabrication process with getter material preparation is presented in this pa...

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Detalles Bibliográficos
Autores principales: Luo, Zhenyu, Chen, Deyong, Wang, Junbo, Li, Yinan, Chen, Jian
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2014
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4299109/
https://www.ncbi.nlm.nih.gov/pubmed/25521385
http://dx.doi.org/10.3390/s141224244

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4299109/
https://www.ncbi.nlm.nih.gov/pubmed/25521385
http://dx.doi.org/10.3390/s141224244

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