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Ductile film delamination from compliant substrates using hard overlayers
Flexible electronic devices call for copper and gold metal films to adhere well to polymer substrates. Measuring the interfacial adhesion of these material systems is often challenging, requiring the formulation of different techniques and models. Presented here is a strategy to induce well defined...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Elsevier
2014
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4307999/ https://www.ncbi.nlm.nih.gov/pubmed/25641995 http://dx.doi.org/10.1016/j.tsf.2014.02.093 |