Uniformity and passivation research of Al(2)O(3) film on silicon substrate prepared by plasma-enhanced atom layer deposition

Plasma-enhanced atom layer deposition (PEALD) can deposit denser films than those prepared by thermal ALD. But the improvement on thickness uniformity and the decrease of defect density of the films deposited by PEALD need further research. A PEALD process from trimethyl-aluminum (TMA) and oxygen pl...

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Detalles Bibliográficos
Autores principales: Jia, Endong, Zhou, Chunlan, Wang, Wenjing
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer US 2015
Materias:
Nano Express
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4385297/
https://www.ncbi.nlm.nih.gov/pubmed/25852420
http://dx.doi.org/10.1186/s11671-015-0831-5

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4385297/
https://www.ncbi.nlm.nih.gov/pubmed/25852420
http://dx.doi.org/10.1186/s11671-015-0831-5

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