A Wafer Level Vacuum Encapsulated Capacitive Accelerometer Fabricated in an Unmodified Commercial MEMS Process

We present the design and fabrication of a single axis low noise accelerometer in an unmodified commercial MicroElectroMechanical Systems (MEMS) process. The new microfabrication process, MEMS Integrated Design for Inertial Sensors (MIDIS), introduced by Teledyne DALSA Inc. allows wafer level vacuum...

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Detalles Bibliográficos
Autores principales: Merdassi, Adel, Yang, Peng, Chodavarapu, Vamsy P.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2015
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4431236/
https://www.ncbi.nlm.nih.gov/pubmed/25815451
http://dx.doi.org/10.3390/s150407349

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4431236/
https://www.ncbi.nlm.nih.gov/pubmed/25815451
http://dx.doi.org/10.3390/s150407349

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