Effect of Ca–Al–Si–O common glass on dielectric properties of low-temperature co-fired ceramic materials with different fillers

High-density integration in single component used for mobile communication is highly demanded with the miniaturization trend in multi-functional light-weighted mobile communication devices. Embedding passive components into multi-layered ceramic chips is also increasingly needed for high integrity....

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Detalles Bibliográficos
Autores principales: Park, Zee-hoon, Yeo, Dong-hun, Shin, Hyo-soon
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Taylor & Francis 2014
Materias:
Article; Biotechnological Equipment
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4433905/
https://www.ncbi.nlm.nih.gov/pubmed/26019606
http://dx.doi.org/10.1080/13102818.2014.949039

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4433905/
https://www.ncbi.nlm.nih.gov/pubmed/26019606
http://dx.doi.org/10.1080/13102818.2014.949039

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