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Effect of Ca–Al–Si–O common glass on dielectric properties of low-temperature co-fired ceramic materials with different fillers
High-density integration in single component used for mobile communication is highly demanded with the miniaturization trend in multi-functional light-weighted mobile communication devices. Embedding passive components into multi-layered ceramic chips is also increasingly needed for high integrity....
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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Taylor & Francis
2014
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4433905/ https://www.ncbi.nlm.nih.gov/pubmed/26019606 http://dx.doi.org/10.1080/13102818.2014.949039 |