Sn–Ag–Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system

Melting temperatures of Sn–Ag–Cu (SAC) alloys in the Sn-rich corner are of interest for lead-free soldering. At the same time, nanoparticle solders with depressed melting temperatures close to the Sn–Pb eutectic temperature have received increasing attention. Recently, the phase stability of nanopar...

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Detalles Bibliográficos
Autores principales: Roshanghias, Ali, Vrestal, Jan, Yakymovych, Andriy, Richter, Klaus W., Ipser, Herbert
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Elsevier B.V 2015
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4456117/
https://www.ncbi.nlm.nih.gov/pubmed/26082567
http://dx.doi.org/10.1016/j.calphad.2015.04.003

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4456117/
https://www.ncbi.nlm.nih.gov/pubmed/26082567
http://dx.doi.org/10.1016/j.calphad.2015.04.003

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