Three-Dimensional Porous Copper-Graphene Heterostructures with Durability and High Heat Dissipation Performance

Porous materials have historically been of interest for a wide range of applications in thermal management, for example, in heat exchangers and thermal barriers. Rapid progress in electronic and optoelectronic technology necessitates more efficient spreading and dissipation of the heat generated in...

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Detalles Bibliográficos
Autores principales: Rho, Hokyun, Lee, Seungmin, Bae, Sukang, Kim, Tae-Wook, Su Lee, Dong, Jung Lee, Hyun, Yeon Hwang, Jun, Jeong, Tak, Kim, Sungmin, Ha, Jun-Seok, Hyun Lee, Sang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2015
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4522598/
https://www.ncbi.nlm.nih.gov/pubmed/26234425
http://dx.doi.org/10.1038/srep12710

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4522598/
https://www.ncbi.nlm.nih.gov/pubmed/26234425
http://dx.doi.org/10.1038/srep12710

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