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Three-Dimensional Porous Copper-Graphene Heterostructures with Durability and High Heat Dissipation Performance
Porous materials have historically been of interest for a wide range of applications in thermal management, for example, in heat exchangers and thermal barriers. Rapid progress in electronic and optoelectronic technology necessitates more efficient spreading and dissipation of the heat generated in...
Autores principales: | Rho, Hokyun, Lee, Seungmin, Bae, Sukang, Kim, Tae-Wook, Su Lee, Dong, Jung Lee, Hyun, Yeon Hwang, Jun, Jeong, Tak, Kim, Sungmin, Ha, Jun-Seok, Hyun Lee, Sang |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group
2015
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4522598/ https://www.ncbi.nlm.nih.gov/pubmed/26234425 http://dx.doi.org/10.1038/srep12710 |
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