Growth kinetics of Cu(6)Sn(5) intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient

The growth behavior of intermetallic compounds (IMCs) at the liquid-solid interfaces in Cu/Sn/Cu interconnects during reflow at 250 °C and 280 °C on a hot plate was investigated. Being different from the symmetrical growth during isothermal aging, the interfacial IMCs showed clearly asymmetrical gro...

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Detalles Bibliográficos
Autores principales: Zhao, N., Zhong, Y., Huang, M.L., Ma, H.T., Dong, W.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2015
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4550914/
https://www.ncbi.nlm.nih.gov/pubmed/26311323
http://dx.doi.org/10.1038/srep13491

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4550914/
https://www.ncbi.nlm.nih.gov/pubmed/26311323
http://dx.doi.org/10.1038/srep13491

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