Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

Direct Cu-to-Cu bonding was achieved at temperatures of 150–250 °C using a compressive stress of 100 psi (0.69 MPa) held for 10–60 min at 10(−3) torr. The key controlling parameter for direct bonding is rapid surface diffusion on (111) surface of Cu. Instead of using (111) oriented single crystal of...

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Detalles Bibliográficos
Autores principales: Liu, Chien-Min, Lin, Han-Wen, Huang, Yi-Sa, Chu, Yi-Cheng, Chen, Chih, Lyu, Dian-Rong, Chen, Kuan-Neng, Tu, King-Ning
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2015
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4649891/
https://www.ncbi.nlm.nih.gov/pubmed/25962757
http://dx.doi.org/10.1038/srep09734

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4649891/
https://www.ncbi.nlm.nih.gov/pubmed/25962757
http://dx.doi.org/10.1038/srep09734

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