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Buckling assisted and lithographically micropatterned fully flexible sensors for conformal integration applications
Development of flexible sensors/electronics over substrates thicker than 100 μm is of immense importance for its practical feasibility. However, unlike over ultrathin films, large bending stress hinders its flexibility. Here we have employed a novel technique of fabricating sensors over a non-planar...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group
2015
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4671021/ https://www.ncbi.nlm.nih.gov/pubmed/26640124 http://dx.doi.org/10.1038/srep17776 |