Engineering interface-type resistive switching in BiFeO(3) thin film switches by Ti implantation of bottom electrodes

BiFeO(3) based MIM structures with Ti-implanted Pt bottom electrodes and Au top electrodes have been fabricated on Sapphire substrates. The resulting metal-insulator-metal (MIM) structures show bipolar resistive switching without an electroforming process. It is evidenced that during the BiFeO(3) th...

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Detalles Bibliográficos
Autores principales: You, Tiangui, Ou, Xin, Niu, Gang, Bärwolf, Florian, Li, Guodong, Du, Nan, Bürger, Danilo, Skorupa, Ilona, Jia, Qi, Yu, Wenjie, Wang, Xi, Schmidt, Oliver G., Schmidt, Heidemarie
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2015
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4686890/
https://www.ncbi.nlm.nih.gov/pubmed/26692104
http://dx.doi.org/10.1038/srep18623

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4686890/
https://www.ncbi.nlm.nih.gov/pubmed/26692104
http://dx.doi.org/10.1038/srep18623

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