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Crack tip shielding observed with high-resolution transmission electron microscopy

The dislocation shielding field at a crack tip was experimentally proven at the atomic scale by measuring the local strain in front of the crack tip using high-resolution transmission electron microscopy (HRTEM) and geometric phase analysis (GPA). Single crystalline (110) silicon wafers were employe...

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Autores principales: Adhika, Damar Rastri, Tanaka, Masaki, Daio, Takeshi, Higashida, Kenji
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Oxford University Press 2015
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4711291/
https://www.ncbi.nlm.nih.gov/pubmed/26115957
http://dx.doi.org/10.1093/jmicro/dfv032
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author Adhika, Damar Rastri
Tanaka, Masaki
Daio, Takeshi
Higashida, Kenji
author_facet Adhika, Damar Rastri
Tanaka, Masaki
Daio, Takeshi
Higashida, Kenji
author_sort Adhika, Damar Rastri
collection PubMed
description The dislocation shielding field at a crack tip was experimentally proven at the atomic scale by measuring the local strain in front of the crack tip using high-resolution transmission electron microscopy (HRTEM) and geometric phase analysis (GPA). Single crystalline (110) silicon wafers were employed. Cracks were introduced using a Vickers indenter at room temperature. The crack tip region was observed using HRTEM followed by strain measurements using GPA. The measured strain field at the crack tip was compressive owing to dislocation shielding, which is in good agreement with the strain field calculated from elastic theory.
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spelling pubmed-47112912016-01-14 Crack tip shielding observed with high-resolution transmission electron microscopy Adhika, Damar Rastri Tanaka, Masaki Daio, Takeshi Higashida, Kenji Microscopy (Oxf) Articles The dislocation shielding field at a crack tip was experimentally proven at the atomic scale by measuring the local strain in front of the crack tip using high-resolution transmission electron microscopy (HRTEM) and geometric phase analysis (GPA). Single crystalline (110) silicon wafers were employed. Cracks were introduced using a Vickers indenter at room temperature. The crack tip region was observed using HRTEM followed by strain measurements using GPA. The measured strain field at the crack tip was compressive owing to dislocation shielding, which is in good agreement with the strain field calculated from elastic theory. Oxford University Press 2015-10 2015-06-26 /pmc/articles/PMC4711291/ /pubmed/26115957 http://dx.doi.org/10.1093/jmicro/dfv032 Text en © The Author 2015. Published by Oxford University Press on behalf of The Japanese Society of Microscopy. http://creativecommons.org/licenses/by-nc/4.0/ This is an Open Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0/), which permits non-commercial re-use, distribution, and reproduction in any medium, provided the original work is properly cited. For commercial re-use, please contact journals.permissions@oup.com
spellingShingle Articles
Adhika, Damar Rastri
Tanaka, Masaki
Daio, Takeshi
Higashida, Kenji
Crack tip shielding observed with high-resolution transmission electron microscopy
title Crack tip shielding observed with high-resolution transmission electron microscopy
title_full Crack tip shielding observed with high-resolution transmission electron microscopy
title_fullStr Crack tip shielding observed with high-resolution transmission electron microscopy
title_full_unstemmed Crack tip shielding observed with high-resolution transmission electron microscopy
title_short Crack tip shielding observed with high-resolution transmission electron microscopy
title_sort crack tip shielding observed with high-resolution transmission electron microscopy
topic Articles
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4711291/
https://www.ncbi.nlm.nih.gov/pubmed/26115957
http://dx.doi.org/10.1093/jmicro/dfv032
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