Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems

In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of extern...

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Detalles Bibliográficos
Autores principales: Okabe, Kenji, Jeewan, Horagodage Prabhath, Yamagiwa, Shota, Kawano, Takeshi, Ishida, Makoto, Akita, Ippei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2015
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4721804/
https://www.ncbi.nlm.nih.gov/pubmed/26694407
http://dx.doi.org/10.3390/s151229885

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4721804/
https://www.ncbi.nlm.nih.gov/pubmed/26694407
http://dx.doi.org/10.3390/s151229885

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