A novel approach of chemical mechanical polishing using environment-friendly slurry for mercury cadmium telluride semiconductors

A novel approach of chemical mechanical polishing (CMP) is developed for mercury cadmium telluride (HgCdTe or MCT) semiconductors. Firstly, fixed-abrasive lapping is used to machine the MCT wafers, and the lapping solution is deionized water. Secondly, the MCT wafers are polished using the developed...

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Detalles Bibliográficos
Autores principales: Zhang, Zhenyu, Wang, Bo, Zhou, Ping, Guo, Dongming, Kang, Renke, Zhang, Bi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2016
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4772544/
https://www.ncbi.nlm.nih.gov/pubmed/26926622
http://dx.doi.org/10.1038/srep22466

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4772544/
https://www.ncbi.nlm.nih.gov/pubmed/26926622
http://dx.doi.org/10.1038/srep22466

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