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A novel approach of chemical mechanical polishing using environment-friendly slurry for mercury cadmium telluride semiconductors
A novel approach of chemical mechanical polishing (CMP) is developed for mercury cadmium telluride (HgCdTe or MCT) semiconductors. Firstly, fixed-abrasive lapping is used to machine the MCT wafers, and the lapping solution is deionized water. Secondly, the MCT wafers are polished using the developed...
Autores principales: | Zhang, Zhenyu, Wang, Bo, Zhou, Ping, Guo, Dongming, Kang, Renke, Zhang, Bi |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group
2016
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4772544/ https://www.ncbi.nlm.nih.gov/pubmed/26926622 http://dx.doi.org/10.1038/srep22466 |
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