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Characteristics and Mechanism of Cu Films Fabricated at Room Temperature by Aerosol Deposition
We were successful in growing a dense Cu film on Al(2)O(3) substrates at room temperature using an aerosol deposition (AD) method. The characteristics of Cu films were investigated through electrical resistivity and X-ray photoelectron spectroscopy (XPS). The resistivity of Cu films was low (9.2–12....
Autores principales: | , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Springer US
2016
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4805680/ https://www.ncbi.nlm.nih.gov/pubmed/27009529 http://dx.doi.org/10.1186/s11671-016-1378-9 |